Semiconductors EMI Shielding - Accelerated Materials

Semiconductor Application

EMI Shielding

Controlled conductive and magnetic particles for thinner, lighter shielding.

Relevant Materials

AM can develop particle populations for package-level shielding when the target chemistry is compatible with the platform

Nano Silver

AM has demonstrated spherical, cubic-phase Ag in the 1–100 nm range. By applying a thin layer of nano silver, electromagnetic waves are reflected providing efficient shielding.

Nano Copper

Copper is a significantly lower cost and more sustainable metal which typically oxidises quickly. By applying a thin layer of nano copper, electromagnetic waves are reflected, reducing crosstalk.

Package-level shielding

As packages become thinner and denser, EMI control is moving onto and inside the package

5G devices and IoT (Internet of Things) require high frequency communications in a confined geometry.

System-in-package, RF and heterogeneous assemblies place multiple functions close enough for unwanted coupling to degrade performance. Package-level approaches use conductive coatings on package tops and sidewalls and conductive pastes in trenches between components.

Commercial package-level systems demonstrate uniform spray-on conductive coatings below 5 µm and conductive trench-fill pastes for compartment shielding. At those dimensions, dispersion and the agglomerate tail become manufacturing variables, not just formulation details.

Material Mechanisms

Different particle systems can contribute through reflection, conduction and absorption

Conductive network

A continuous conductive pathway reflects and redistributes electromagnetic energy. Percolation depends on conductivity, contact resistance, aspect ratio and loading.

Magnetic loss

Magnetic particles or hybrid systems can add absorption mechanisms. Phase composition and magnetic properties must be controlled for the target frequency range.

Coating integrity

Thickness uniformity, pinhole control, adhesion and sidewall coverage can be as important as bulk conductivity.

Process window

Micrometre-scale coatings magnify every inconsistency in the particle population

Agglomerate ceiling

The largest effective agglomerate must remain compatible with the coating thickness or trench geometry.

Spray or trench rheology

Spray coating and narrow-trench filling require different viscosity, solids loading, thixotropy and drying behaviour.

Reliability

The shielding layer must survive moisture, thermal cycling and package flex without cracking or delaminating.

What to qualify

Shielding effectiveness should be traced back to particle and coating data

PSD and agglomerate tail after formulation, storage and recirculation.

Particle morphology and, for magnetic systems, phase identity and magnetic response.

Film conductivity versus loading and cure conditions.

Coating thickness, sidewall coverage, roughness, adhesion and cross-sectional uniformity.

Shielding effectiveness across the relevant frequency band before and after reliability exposure.

The AM development route

Treat conductivity, morphology, dispersion and the package application process as one development problem

How We Work

K1 · Particle and formulation screen

Screen compatible chemistries, particle size, morphology and surface state against dispersion, application rheology and early film conductivity.

K10 · Package coating validation

Produce repeat material for spray or trench-fill trials, cross-section analysis, adhesion and RF shielding measurements.

K100 · Supply continuity

Increase output after the material and coating process are qualified, maintaining the particle population tied to shielding performance.