Semiconductor Applications
Back end opportunities
Improving thermal conductivity to increase packaged stability and reduce cooling costs. Start with the package interface or manufacturing step you need to improve.
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Semiconductor Applications

Start with the process challenge

Choose the application closest to your manufacturing or development challenge. Each route connects the manufacturing requirement to the particle attributes, chemistry and scale up pathway needed to reach it.
Explore semiconductor materials
Back End & Packaging

Die Attach & Interconnects

Engineer conductive particle systems around the required joint performance, processing window and reliability target.

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Back End & Packaging

Thermal Interface Materials

Build thermally efficient, electrically insulating interfaces through controlled ceramic and nitride filler populations.

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Back End & Packaging

EMI Shielding

Develop conductive and magnetic particle systems for thinner package level shielding and compartmental isolation.

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Start with the package

Bring the full specification

Discuss the application, process window, performance target and current materials bottleneck with AM

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